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Applied Materials: Applied Materials Enables Cost-Effective Vertical Integration of 3D Chips

* Endura® Ventura(TM) PVD system allows high aspect ratio through-silicon via
(TSV) structures for copper interconnects while reducing cost of ownership
by up to 50 percent
* Industry's first high-volume manufacturing PVD titanium barrier solution
for improved TSV reliability

SANTA CLARA, Calif., May 28, 2014 - Applied Materials, Inc. today introduced
theEndura® Ventura(TM) PVD systemthat helps customers reduce the cost of
fabricating smaller, lower power, high-performance integrated 3D chips. The
system incorporates Applied's latest innovations to its industry-leading PVD*
technology that enables the deposition of thin, continuous barrier and seed
layers in through-silicon-vias (TSVs). Demonstrating Applied's precision
materials engineering expertise, the Ventura system also uniquely supports
the use of titanium in volume production as an alternate barrier material for
lower cost. With the launch of the Ventura system, Applied is expanding its
comprehensive toolset for wafer level packaging (WLP) applications, including
TSVs, redistribution layer (RDL) and Bump*.

TSVs are a critical technology for vertically fabricating smaller and lower
power future mobile and high-bandwidth devices. Vias are short vertical
interconnects that pass through the silicon wafer, connecting the active side
of the device to the back side of the die, providing the shortest
interconnect path between multiple chips. Integrating 3D stacked devices
requires greater than 10:1 aspect ratio TSV interconnect structures to be
metallized with copper. The new Ventura tool solves this challenge with
innovations in materials and deposition technology to manufacture TSVs more
cost-effectively than previous industry solutions.

"Building on 15 years of leadership in copper interconnect technology, the
Ventura system enables fabrication of robust high-aspect ratio TSVs, with up
to 50 percent barrier seed cost savings compared to copper interconnect PVD
systems," said Dr. Sundar Ramamurthy, vice president and general manager
ofMetal Deposition Productsat Applied Materials. "These innovations deliver a
higher-performance and more functional, yet, compact chip package with less
power consumption to meet leading-edge computing needs. Customers are
realizing the benefits of this new PVD system and are qualifying it for
volume manufacturing."

Supporting the manufacture of high-yielding 3D chips, the Ventura system
introduces advances in ionized PVD technology that assure the integrity of
the barrier and seed layers that are critical to superior gap-fill and
interconnect reliability. These developments significantly improve ion
directionality to enable the deposition of thin, continuous and uniform metal
layers deep into the vias to achieve the void-free fill necessary for robust
TSVs. With the improvement in directionality, higher deposition rates can be
achieved, while the amount of barrier and seed material needed can be
reduced. These attributes of the Ventura system and the adoption of titanium
as an alternate barrier are expected to improve device reliability and reduce
the overall cost of ownership for TSV metallization.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products.
Our technologies help make innovations like smartphones, flat screen TVs and
solar panels more affordable and accessible to consumers and businesses
around the world. Learn more atwww.appliedmaterials.com.

*PVD = physical vapor deposition
*Under Bump Metallization = used to connect the die to substrate

# # #

Connie Duncan(editorial/media) 408.563.6209

Michael Sullivan(financial community) 408.986.7977

PHOTO: Applied Materials Endura® Ventura™ PVD system


This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Globenewswire


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