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2014-05-13

Applied Materials: Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years

* New Endura®Volta(TM)CVD system's unique cobalt processes ease interconnect
bottlenecks to enable continued Moore's Law scaling
* Two breakthrough interconnect applications designed to support future
generations of high-performance, low-power microchips
* Industry's first selective CVD metal process demonstrates Applied's
leadership in precision materials engineering

SANTA CLARA, Calif., May 13, 2014 - Applied Materials, Inc. today announced
itsApplied Endura®Volta(TM) CVD Cobalt system, the only tool capable of
encapsulating copperinterconnectsin logic chips beyond the 28nm node by
depositing precise, thin cobalt films. The two enabling applications, a
conformal cobalt liner and a selective cobalt capping layer, provide complete
enclosure of the copper lines, improving reliability by an order of
magnitude. The introduction of cobalt as a superior metal encapsulation film
marks the most significant materials change to the interconnect in over 15
years.

"The reliability and performance of the wiring that connects the billions of
transistors in a chip is critical to achieve high yields for device
manufacturers. As wire dimensions shrink to keep pace with Moore's Law,
interconnects are more prone to killer voids and electromigration failures,"
said Dr. Randhir Thakur, executive vice president and general manager of the
Silicon Systems Group at Applied Materials. "The Endura Volta system builds
on Applied's precision materials engineering leadership by deliveringCVD*-
based cobalt liner and selective cobalt capping films that overcome these
yield-limiting issues to enable our customers to scale copper interconnects
to beyond the 28nm node."

The Endura Volta CVD system, with its two new process steps, represents a
major technology extension for copper interconnects beyond 28nm. The first
step involves the deposition of a thin, conformal CVD cobalt liner to
increase the gap fill window of copper in narrow interconnects. This process
improves the performance and yield of the device by integrating the
pre-clean,PVD*barrier, CVD cobalt liner and copper seed processes under
ultra-high vacuum on the same platform.

The second step, a new "selective" CVD cobalt capping step, is deposited
afterCMP* to encapsulate the copper lines for enhanced reliability
performance. Complete envelopment of copper lines with cobalt creates an
engineered interface that demonstrates over 80x improvement in device
reliability.

"Applied's unique CVD cobalt processes represent an innovative
materials-enabled scaling solution," said Dr. Sundar Ramamurthy, vice
president and general manager of Metal Deposition Products at Applied
Materials. "It is deeply satisfying that these materials and process
innovations in development for almost a decade are now being adopted by our
customers for their high-performance mobile and server chips."

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products.
Our technologies help make innovations like smartphones, flat screen TVs and
solar panels more affordable and accessible to consumers and businesses
around the world. Learn more atwww.appliedmaterials.com.

# # #

*PVD = physical vapor deposition; CVD = chemical vapor deposition; CMP =
chemical mechanical planarization

Contact:
Connie Duncan(editorial/media) 408.332.0541

Michael Sullivan(financial community) 408.986.7977

PHOTO: Applied Materials Endura® Volta™ CVD Cobalt System
http://hugin.info/143724/R/1784861/611765.jpg

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This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Globenewswire

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