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2015-04-20

Applied Materials: Applied Materials' New Photomask Etch System Enables the Extension of Multiple Patterning to 10nm and Beyond

* Centura®Tetra(TM) Z system is industry's first photomask etch solution for
quadruple patterning at 10nm and beyond
* World-class photomask etch performance and defect control meet advanced
patterning requirements for logic and memory devices

SANTA CLARA, Calif., April 20, 2015 - Applied Materials today announced the
Applied Centura®Tetra(TM)Z Photomask Etch systemfor etching next-generation
optical lithographic photomasks needed by the industry to continue multiple
patterning scaling to the 10nm node and beyond. The new tool extends the
capabilities of Applied's industry-leading Tetra platform, delivering
angstrom-level photomask accuracy for critical dimension (CD) parameters
required to meet stringent patterning specifications for future logic and
memory devices.

"Our Tetra Z system represents the state of the art in photomask etch
technology, employing advances in precision materials engineering and plasma
reaction kinetics to extend the use of 193nm lithography," said Rao
Yalamanchili, general manager of Applied's Mask Etch product division. "Using
the 193nm wavelength to produce 10nm or 7nm patterns requires a range of
optimization techniques, including immersion and multiple patterning, which
rely heavily on photomasks. Etch technology is key for photomask fabrication;
the Tetra Z system is unique in delivering the accuracy required to etch
next-generation optical photomasks for patterning advanced node designs."

Applied developed the Tetra Z tool for advanced chrome, MoSi*, hard mask and
quartz (fused silica) etch applications used to fabricate advanced binary and
phase-shift masks (PSMs). Offering continuous technical innovations and
unprecedented CD performance, the system extends immersion lithography for
quadruple patterning and cutting-edge resolution enhancement techniques.
Vital capabilities ensuring pattern transfer fidelity include uniform, linear
precision etching across all feature sizes and pattern densities with
virtually zero defectivity.

Excellent CD performance combined with high etch selectivity enable the use of
thinner resist films for achieving smaller photomask CD patterns on critical
device layers. Controllable CD bias capability expands the system's
flexibility to meet customer specific requirements. Unique quartz etch depth
control ensures precision phase angle and aids integrated circuit scaling by
providing customers the capability to use alternating aperture PSMs and
chromeless phase lithography. These key advances derive from a variety of
system improvements in chamber design, plasma stability, ion and radical
control, flow and pressure control, and real-time process monitoring and
control.

Applied's Tetra systems have been selected by a majority of mask makers
worldwide to etch high-end photomasks over the past decade.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in precision
materials engineering solutions for the semiconductor, flat panel display and
solar photovoltaic industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and accessible
to consumers and businesses around the world. Learn more
atwww.appliedmaterials.com.

*MoSi = molybdenum silicon oxynitride
# # #
Contacts:

Connie Duncan(editorial/media) 408.563.6209

Michael Sullivan(financial community) 408.986.7977

PHOTO: Applied Centura® Tetra™ Z Photomask Etch System
http://hugin.info/143724/R/1912188/682441.jpg

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This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Globenewswire

HUG#1912188

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