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Ericsson: Ericsson-backed research project breaks new ground in silicon photonic integration

* New silicon photonics chip increases bandwidth, reduces cost and enables
optical routing in the cloud and 5G era
* First chip now in testing&characterization phase
* IRIS project co-funded by European Commission

The Ericsson-led IRIS project has produced a silicon photonics switch designed
for housing thousands of optical circuits on a single chip.

The first chip is now in the test and characterization phase, and if
successful the outcome will be major breakthrough for the industry, paving
the way for a new generation of optical systems integrated in a single
Silicon photonics uses silicon as a miniaturized optical medium for
transmitting and switching data at very high speeds, which reduces power
consumption and footprint and increases capacity, which combined will lead to
lower operational costs.

Co-funded by the European Commission as a Specific Target Research Project
(STREP) under the Seventh Framework Programme for research and development
(FP7), the IRIS project aims to create a high-capacity and reconfigurable WDM
photonic switch using silicon photonics to monolithically integrate circuits
in a single chip.

Such a chip will enable network operators to enhance the network performance,
increasing node capacity as required by future 5G networks and Cloud. This
can be achieved by high-scale integration of features, such as high-speed
transmission, switching, and interconnectivity in the same chip.

The award winning Ericsson Hyperscale Datacenter System 8000 is an example
where silicon photonics technology is being implemented already. With its
optical interconnect, it brings major benefits to datacenter operators in
terms of total cost of ownership.

Peter Christy, Research Director at 451 Research says; "Optical
interconnection will play a critical role in data center evolution. Silicon
photonics improves the cost and power efficiency very significantly. The
Ericsson cloud initiative and HDS 8000 are early movers in the commercial
exploitation of silicon photonics in the datacenter, and systems like this
clearly demonstrate the technology's potential."

Researchers from Ericsson in Pisa have generated and filed all the relevant
patent proposals.

The project consortium is led by Ericsson (Italy) and includes ST
Microelectronics (Italy), CEA-LETI (France), CNIT (Italy), University of
Trento (Italy), Universitat Politecnica de Valencia (Spain), Technische
Universitat Wien (Austria) and Electronics and Telecommunications Research
Institute (Republic of Korea).

For more information about the project,


Media kit: Cloud

Media kit: 5G

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Ericsson-backed project breaks new ground in silicon photonic


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The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Ericsson via Globenewswire


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