Du är här

2014-04-15

Isola Group: High-Speed Digital Materials for Sequential Lamination Technology Gain Momentum

Isola's I-Speed is Recognized for High CAF Reliability and Improved Signal
Integrity in Complex PCB Designs

CHANDLER, Ariz., April 15, 2014 (GLOBE NEWSWIRE) --Isola Group S.à r.l., a
market leader in copper-clad laminates and dielectric prepreg materials used
to fabricate advanced multilayer printed circuit boards (PCBs), announced
today thatI-Speed®has been endorsed by two leading companies as the laminate
of choice for PCBs using sequential lamination technology, requiring high
conductive anodic filament ("CAF") reliability and improved, cost effective
signal integrity.

Today's PCBs requiring sequential lamination are increasingly complex to
fabricate. This manufacturing process is necessary when the design of the
interconnect system has connections that are not required on all layers or
that if made available on all layers, would affect the system's performance
or create an unsolvable congestion in the design. Boards requiring sequential
lamination must be able to withstand multiple reflow cycles at high assembly
temperatures.

Steve Robinson, President and CEO ofAPCT, stated, "Material choice is a
critical factor in the success with sequential lamination designs. At APCT,
we rely heavily on I-Speed materials from Isola. Other laminates fail after
only a couple of cycles, whereas I-Speed demonstrates excellent performance
even after several lamination cycles. At APCT, any product requiring more
than two lamination cycles automatically defaults to I-Speed."

Lee Ritchey, President ofSpeeding Edge, a training and consulting firm
specializing in high-speed PCB and system designs, stated, "We had an
independent fabricator build identical signal integrity test vehicles on
competitive materials on boards designed by our company. At Isola's request,
we had the boards tested for insertion loss at our labs. The results proved
I-Speed to be the best in its class for signal integrity."

Fred Hickman, Isola's Senior Director of High Speed Digital Products,
commented, "I-Speed has demonstrated superior sequential lamination
performance versus the competition. A large multinational fabricator, for
example, succeeded on its first 1+8+8+1 HDI build with I-Speed, after failing
multiple times with a competitive product." Hickman added, "CAF is another
area where I-Speed delivers best-in-class performance; it has successfully
passed 0.65 mm pitch on an industry-standard test vehicle, as well as the
high density product users group (HDPUG) test vehicle after 6X reflow at 260
degrees C. It also passed the 0.8 mm pitch thermal requirements on both
designs without any issues after 6X reflow at 260 degrees C."

I-Speed comes standard with VLP-2 copper with an approximate 2-micrometer (um)
surface roughness (Rz) without cost premium. I-Speed is in the same UL family
as Isola'sIS415,FR408andFR408HRmaterials. Processing of I-Speed is very
similar to processing Isola's FR408HR materials. I-Speed offers much lower
Z-axis expansion, improved thermal robustness in lead-free assembly and at
least 15 to 25 percent more bandwidth (lower insertion loss) than competitive
products.

I-Speed production is scaling up at Isola's manufacturing facility in
Chandler, Ariz. The company plans to transfer production to one of its two
facilities in Taiwan to support the demand for the product in a number of
next-generation, high-speed digital designs, for supercomputers, servers,
routers, storage equipment and lower-end RF applications.

Tarun Amla, Isola's Executive Vice President and Chief Technology Officer,
commented, "We are pleased that APCT and Speeding Edge have endorsed
I-Speed's thermal performance, CAF mitigation, sequential lamination and
signal integrity. This material is a cost effective, efficient solution for
many of today's advanced PCBs."

For more information about I-Speed, please
visithttp://www.isola-group.com/products/i-speed/.

About Isola

Isola Group S.à r.l., headquartered in Chandler, Arizona, is a global material
sciences company focused on designing, developing, manufacturing, and
marketing copper-clad laminates and dielectric prepregs used to fabricate
advanced multilayer printed circuit boards. The company's high-performance
materials are used in sophisticated electronic applications in the
communications infrastructure, computing/networking, military, medical,
aerospace and automotive industries. For more information, visit our website
athttp://www.isola-group.com.

CONTACT: Editorial Contact:
Tiffany C. Zinn
Global Marketing Communications Manager
Isola Group
480-282-6368
Tiffany.Zinn@isola-group.com

---------------------------------------

This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Isola Group via Globenewswire

HUG#1776994

Författare Hugin

Tala om vad ni tycker

Tala om vad ni tycker

Ni är just nu inne på en betaversion av nya aktiespararna. Lämna gärna feedback på vad ni tycker i formuläret nedan.