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2014-04-08

Isola Group: Isola Launches CAF Mitigation Technology-Licensing Program

Offered to Manufacturers of PCB Laminates to Reduce Voids in Cured, Resin-Filled Substrates.CHANDLER, Ariz., April 8, 2014 (GLOBE NEWSWIRE) --Isola Group S.à r.l., a
market leader in engineered dielectric materials used to fabricate advanced
multilayer printed circuit boards (PCBs), announced today that the company
has launched a technology-licensing program to mitigate conductive anodic
filamentation (CAF) problems in the fabrication of PCBs. This proprietary
manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA",
reduces the number of voids in resin-impregnated dielectrics, which is a
major source of CAF failures. The license is available to laminate and
prepreg manufacturers and users worldwide and is protected by U.S. patent
number 6,083,855, Taiwan patent number I230657, patents in several additional
countries and by know-how.

Advancements in laminate manufacturing procedures, as well as the resins and
reinforcing materials used in the laminates, have resulted in laminate
products that are manufactured quickly and efficiently with a high degree of
strength and reliability. Laminates are prepared by impregnating a fibrous
reinforcement material with a blend of liquid resin polymeric. The
impregnated fabric is then heated and brought to a semi-cured, tack-free
stage called prepreg. In the absence of an effective "void reduction"
technology, prepregs typically include voids, such as small air pockets in
the fiber bundles and in the interstitial spaces between the fiber bundles,
which are a common source of CAF problems. The next step in the manufacturing
process of a copper-clad laminate is the lamination of the prepreg between
thin layers of copper foil, by the application of an appropriate temperature
and pressure profile. A majority of the voids in the prepreg get locked-up in
this final, fully cured state.

Isola's technology-licensing program provides a laminate impregnation process
that is capable of producing high quality, resin-impregnated prepreg,
substantially free of voids, which mitigates CAF failure. CAF is of constant
concern to original equipment manufacturers and PCB designers, as they strive
to improve the reliability and quality of their products. Smaller hole-pitch
geometries make PCBs susceptible to CAF growth, a form of electromechanical
migration within the board. CAF failures may occur for several reasons,
including:

* The incompatibility of the silane finish with the resin or the glass
* A weak interfacial bond between the resin and the glass
* Hollow fibers (an artifact of the yarn manufacturing process)
* Poor drilling at the PCB fabricator, leading to crazing and debonding
* Voids after the impregnation process. These voids are often referred to as
interlaminar yarn voids (IYVs), striations and in some special cases,
triple points.

Tarun Amla, Executive Vice-president and Chief Technology Officer at Isola,
noted that the current trend in electronics manufacturing toward smaller,
thinner, lighter-weight and higher-performance products results in a tighter
pitch between the interconnect holes drilled in PCBs. He commented, "Voids in
the dielectric act as precursors to CAF pathways, causing early failures and
thus pose serious reliability and safety risks. An effective risk-mitigation
technique will reduce or eliminate the voids that develop during the
impregnation process."

Laminate manufacturers that are interested in licensing Isola's CAF mitigation
technology should contact General Counsel, Mike Rafford at Isola USA. For
those wishing to confirm whether their existing supplier is an authorized
participant in this licensing program or for those who would like additional
information, please contact Isola USA directly at 800-537-7656
orinfo@isola-group.com.

About Isola

Isola Group S.à r.l., headquartered in Chandler, Arizona, is a global material
sciences company focused on designing, developing, manufacturing, and
marketing copper-clad laminates and dielectric prepregs used to fabricate
advanced multilayer printed circuit boards. The company's high-performance
materials are used in sophisticated electronic applications in the
communications infrastructure, computing/networking, military, medical,
aerospace and automotive industries. For more information, visit our website
athttp://www.isola-group.com.

CONTACT: Editorial Contact:
Tiffany C. Zinn
Global Marketing Communications Manager
Isola Group
480-282-6368
Tiffany.Zinn@isola-group.com

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This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Isola Group via Globenewswire

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